ESL 8884-G is a newly developed gold conductor, which can also be used as aninterconnect paste in SOFC and other fuel cells. It is a fritless gold paste that isdesigned to be used on 96% alumina and on tape-cast SOFC materials. It exhibitsexcellent wire bonding characteristics and, in addition to SOFC materials, can beused on ESL?s cadmium, lead, and nickel-free dielectrics such as ESL 4920.
Specification Information
• Sofc • Category • Rheology • Viscosity • Bonding Mechanism • Shelf Life (25 ºC) • Screen Mesh/Emulsion • Leveling Time (25 ºC) • Drying (125 ºC) • Firing Range • Firing Range: Optimum • Firing Range: Time At Peak • Firing Cycle • Rate of Ascent/Decent • Substrate of Calibration • Thinner • Unit Size
H-Tech will work directly with you to address any manufacturer defects or other warranty issues in order to resolve any problem quickly and efficiently with minimum consumer effort.
• Estimated Ship Dimensions: 6" x 6" x 6" • Estimated Ship Weight: 1 lbs • Lead time: 21 days • Shipping origin: King of Prussia, United States Please contact us for pricing on this product. H-Tech's Shipping Policy
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